“Chenghao”的版本间的差异
来自南京大学IIP
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I am interested in Machine Learning and Mechanism design. Currently I am focusing on the subfields: | I am interested in Machine Learning and Mechanism design. Currently I am focusing on the subfields: | ||
− | *path auctions | + | *path auctions in crowdsourcing |
− | * | + | *data valuation |
<font color="#3498db"><span style="caret-color: rgb(52, 152, 219); font-size: 15.600000381469727px;">'''Award or honor'''</span></font> | <font color="#3498db"><span style="caret-color: rgb(52, 152, 219); font-size: 15.600000381469727px;">'''Award or honor'''</span></font> |
2020年9月25日 (五) 10:08的版本
PhD Candidate @ IIP Group
Email: njuchengh@163.com | |
Supervisor
Professor Chong-Jun Wang
Biography
I received my B.Sc. degree in of Nanjing University in June 2017. In the same year, I was admitted to study for a Phd degree in Nanjing University without entrance examination.
Currently I am a first year PhD student of Department of Computer Science and Technology in Nanjing University and a member of IIP Group, led by professor Jun-Yuan Xie and Chong-Jun Wang.
Research Interest
I am interested in Machine Learning and Mechanism design. Currently I am focusing on the subfields:
- path auctions in crowdsourcing
- data valuation
Award or honor
- National Scholarship for Encouragement 2016
- Principal Special Freshman Scholarship 2017
- Artificial Intelligence Scholarship 2018
- First-Class Doctoral Excellence Scholarship of Nanjing University 2019
meetings
Publications
- Cheng h, Zhang l, Zhang y, Wu J, Wang C. Optimal Constraint Collection for Core-selecting Path Mechanism[C]. In Proceedings of AAMAS. Stockholm, Sweden, 2018. [链接].
- Cheng, H., Zhang, W., Zhang, Y., Zhang, L., Wu, J., & Wang, C. (2020). Fast core pricing algorithms for path auction. Autonomous Agents and Multi-Agent Systems, 34(1), 18.[pdf]
- Zhang, Y., Zeng, C., Cheng, H., Wang, C., & Zhang, L. (2019, July). Many could be better than all: A novel instance-oriented algorithm for Multi-modal Multi-label problem. In 2019 IEEE International Conference on Multimedia and Expo (ICME) (pp. 838-843). IEEE.